Cadence Allegro X Advanced Package Designer empowers designers to efficiently navigate the complexities of multi-die packages with features like on-the-fly library development, constraint-driven routing, and comprehensive signal integrity analysis. Its seamless integration into the silicon-package-board design flow and support for diverse layout options make it the ideal solution for optimizing cost, performance, and time-to-market.
Key Benefits:
Key Benefits:
- Accelerated Package Design: Create complex multi-die packages using the industry's most extensive design rules for advanced substrates. This approach simplifies the process and enhances efficiency by up to 50%, thanks to seamless integration and automated layout guidance.
- Enhanced Design Confidence: Move to in-design analysis with Cadence's advanced engines for electrical, EM, and thermal validations. This approach reduces design validation time by over 30% through real-time checks.
- Facilitates Co-Design and Signoff: Ensure seamless co-design between IC packages and digital/analog RF-ICs using vendor ADKs for guided layout and signoff. This process ensures efficient and reliable multi-die packages, minimizes redesigns, and accelerates time-to-market.
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