Request Your AuraStack AI Super Agent Trial

Bring agentic AI to your PCB and advanced packaging design.

AuraStack AI Super Agent coordinates specialized AI agents across system planning, implementation, and multiphysics analysis, all working from a shared model of your design intent, constraints, and physical structures.

Get hands-on access so you can test it on a real design from your own workflow and measure the results yourself.

• Automate system-level floorplanning, die connectivity, constraints management, and design reuse across PCB, package, multiboard, and multi-RDL systems
• Generate and optimize fanout, breakout, transitions, and power and ground planes, with AI-driven place-and-route
• Run IR drop, crosstalk, return path, reflection, thermal, and DFM checks earlier, before final signoff
• Bring separate engineering teams into one multiphysics-aware environment with a consistent view of tradeoffs

Complete the form to request your trial.