The rapid evolution of 3D integrated circuits (3D-ICs) presents unprecedented opportunities in high-performance computing (HPC) and AI-driven systems-on-chip (SoCs). However, thermal challenges remain a critical factor affecting performance, reliability, and scalability.

Our latest white paper, "Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC," dives deep into:
  • The impact of 3D integration on power density, heat dissipation, and performance
  • Comparative analysis of EμBumps vs. wafer-to-wafer hybrid bonding (W2WHB) for 3D interconnects
  • Functional partitioning strategies (Memory-on-Logic, Logic-on-Memory, and Logic-on-Logic) and their thermal implications
  • Advanced power delivery solutions (frontside vs. backside PDN) and their role in mitigating thermal resistance
  • Sensitivity analysis of material properties in 3D interface layers to optimize thermal performance
Leveraging real-world SoC implementations and industry-leading simulation tools, this study provides actionable insights for engineers, chip designers, and researchers tackling the thermal constraints of next-gen 3D-ICs.


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