Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost.
Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable seamless IC/package co-design.
Discover how the new Virtuoso Studio RF platform from Cadence accelerates RFIC/MMIC design and heterogeneous integration.
In this white paper, you'll learn how to:
- Leverage concurrent RF/physical design entry for faster design cycles
- Use Spectre simulation and optimization to enhance performance
- Perform in-design EM and thermal analyses for greater design accuracy
- Achieve seamless co-design across silicon, laminate, and system domains
Download the white paper now and take your wireless design to the next level.