Want to see the exciting technology behind some of the biggest innovations at embedded world? Book a meeting to visit Cadence technical experts from March 10 – 12 at Nuremberg Messe, Hall 4, booth 4-219.
Fill out the form to book a meeting.
Learn about a wide range of Cadence IP, tools, and silicon solutions for the automotive, aerospace, consumer, and data center markets, built on decades of expertise.
Demos include:
Fill out the form to book a meeting.
Learn about a wide range of Cadence IP, tools, and silicon solutions for the automotive, aerospace, consumer, and data center markets, built on decades of expertise.
Demos include:
- Automotive In-Cabin Sensing: Tensilica HiFi DSPs
- Automotive Radar ADAS: Tensilica ConnX and MathX DSPs
- Edge AI-Enabled Sound Tuning In-Cabin Active Noise Reduction: Tensilica HiFi DSP
- Thermal/EMC ECU PCB Design Analysis and Optimization
- Pre-Silicon and Post-Silicon Software Development and Test with VLAB VDMs
- Securyzr™ neo Core Platform: PPA-optimized embedded cybersecurity (Secure-IC)
- Securyzr™ Xperience: Early access to security innovation (Secure IC)