Easily tackle today’s most complex electromagnetic (EM) challenges with gold-standard accuracy. Design critical interconnects for PCBs, IC packages, and system-on-IC (SoIC) designs.
Cadence Clarity 3D Solver leverages industry-leading distributed multiprocessing technology and delivers virtually unlimited capacity and the 10X speedup required to efficiently and effectively address larger and more complex structures.
Key Benefits:
Cadence Clarity 3D Solver leverages industry-leading distributed multiprocessing technology and delivers virtually unlimited capacity and the 10X speedup required to efficiently and effectively address larger and more complex structures.
Key Benefits:
- Create highly accurate S-parameter models for use in high-speed signal integrity (SI), power integrity (PI), high-frequency RF/microwave applications, and electromagnetic compliance (EMC) analysis
- Obtain simulation results that match lab measurements, even at 112Gbps+ data transfer speeds
- Massively parallelized matrix solver technology with adaptive mesh refinement and frequency sweep processes for near-linear scalability
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