Need advanced, power-aware signal and power integrity (SI/PI) technologies within an integrated and collaborative design environment to boost productivity, meet compressed schedules, and bring products to market on time and within budget?

Cadence Sigrity X technology provides high-speed system designers with comprehensive, end-to-end SI/PI analysis, in-design interconnect modeling, and power delivery network (PDN) analysis for PCB and IC package designs.

Sigrity X technology works with all major PCB and IC package design platforms, including Cadence’s Allegro X PCB, Allegro X Package, and Integrity 3D-IC solutions, along with Clarity 3D Solver for electromagnetic analysis.

Key Benefits

  • Minimize design respins by identifying SI/PI issues early in the design process
  • Maintain signoff accuracy with confidence while achieving a 10X performance increase
  • Seamlessly integrate with Cadence PCB and IC Design tools to boost efficiency and avoid manual re-entry mistakes
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